US Patent Issued to Yamaha Robotics on Nov. 18 for "Manufacturing apparatus of semiconductor device and manufacturing method of semiconductor device" (Japanese Inventor)

ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,475,551, issued on Nov. 18, was assigned to Yamaha Robotics Co. Ltd. (Tokyo).

"Manufacturing apparatus of semiconductor device and manufacturing method of semiconductor device" was invented by Yoshiyuki Ogata (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A manufacturing apparatus of a semiconductor device includes: multiple processing heads provided apart from each other in order to perform predetermined processing in different positions on a common lead frame, the processing heads respectively including cameras; and a controller controlling driving of the processing heads, the controller positioning each of the processing heads at a position wh...