ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,489,003, issued on Dec. 2, was assigned to Yamaha Robotics Co. Ltd. (Tokyo).
"Wire bonding system, inspection device, wire bonding method, and recording medium" was invented by Hiroyuki Kasama (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "A wire bonding system according to the present invention comprises: an acquisition unit that acquires information pertaining to the diameter of a pressure-bonded ball where a wire is pressure-bonded to an electronic component by wire bonding; a first storage unit that stores the information pertaining to the pressure-bonded ball diameter which has been acquired by the acquisition unit; and an inspection unit tha...