ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,485,586, issued on Dec. 2, was assigned to Yamaha Robotics Co. Ltd. (Tokyo).
"Mold clamping device" was invented by Masahiko Fujisawa (Nagano, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A mold clamping device is provided with a movable platen that moves along a tie bar; a driving mechanism having multiple raising-lowering mechanisms, including a first raising-lowering mechanism and a second raising-lowering mechanism, and configured to be capable of introducing a difference so that a first portion of the movable platen corresponding to the first raising-lowering mechanism is set at a higher position or a lower position than a second portion of ...