US Patent Issued to Yamaha Robotics Holdings on May 13 for "Wafer cleaning apparatus and bonding system" (Japanese Inventors)

ALEXANDRIA, Va., June 12 -- United States Patent no. 12,300,516, issued on May 13, was assigned to Yamaha Robotics Holdings Co. Ltd. (Tokyo).

"Wafer cleaning apparatus and bonding system" was invented by Hiroshi Kikuchi (Tokyo) and Kinn Ri (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wafer cleaning apparatus for cleaning a surface of a wafer includes: a wet cleaning unit that cleans the surface of the wafer with liquid; and a dry cleaning unit that cleans the surface of the wafer with atmospheric pressure plasma, and the dry cleaning unit is disposed above the wet cleaning unit to overlap the wet cleaning unit."

The patent was filed on March 30, 2022, under Application No. 18/015,075.

*For furth...