US Patent Issued to YAGEO on Nov. 11 for "Thin-film chip resistor-capacitor for miniaturization and thinning" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,469,646, issued on Nov. 11, was assigned to YAGEO Corp. (Kaohsiung, Taiwan).

"Thin-film chip resistor-capacitor for miniaturization and thinning" was invented by Shen-Li Hsiao (Kaohsiung, Taiwan), Kuang-Cheng Lin (Kaohsiung, Taiwan) and Po-Hsun Shih (Changhua County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A thin-film chip resistor-capacitor includes a substrate, a resistor layer, a dielectric layer, a thin-film capacitor layer, a first terminal electrode and a second terminal electrode. The resistor layer is disposed on the substrate. The dielectric layer is disposed on the resistor layer. The thin-film capacitor layer is disposed on the ...