US Patent Issued to xMEMS Labs on June 17 for "Cantilever structure with intermediate substrate connection having a film with on anchor with protrusion" (Taiwanese, American Inventors)

ALEXANDRIA, Va., June 19 -- United States Patent no. 12,330,933, issued on June 17, was assigned to xMEMS Labs Inc. (Santa Clara, Calif.).

"Cantilever structure with intermediate substrate connection having a film with on anchor with protrusion" was invented by Jye Ren (Taipei, Taiwan), Jemm Yue Liang (Sunnyvale, Calif.) and Wen-Chien Chen (New Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A cantilever structure includes an anchor portion and a film structure. The film structure covers over a cavity and vibrates within the cavity. A length of the film structure is less than a width of the film structure. The anchor portion includes at least one protrusion protruding toward the cavity, and the...