US Patent Issued to Xintec on Sept. 23 for "Chip package and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,424,567, issued on Sept. 23, was assigned to Xintec Inc. (Taoyuan, Taiwan).

"Chip package and manufacturing method thereof" was invented by Hsin-Yi Chen (Taoyuan, Taiwan), Sheng-Hsiang Fu (Taoyuan, Taiwan), Ching Ting Peng (Taoyuan, Taiwan) and Ho Yin Yiu (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A chip package includes a semiconductor substrate, an interlayer dielectric (ILD) layer, a first metal shielding layer, and a redistribution layer. The semiconductor substrate has a first surface, a second surface facing away from the first surface, an inclined sidewall adjoining the first and second surfaces, and a through hole through t...