ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,477,848, issued on Nov. 18, was assigned to XINTEC INC. (Taoyuan, Taiwan).
"Chip package and method for forming the same" was invented by Chia-Ming Cheng (New Taipei, Taiwan) and Shu-Ming Chang (New Taipei, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A chip package is provided. The chip package includes a first semiconductor chip, a second semiconductor chip, a first encapsulating layer, a second encapsulating layer, a first through-via, and a second through-via. The second semiconductor chip is stacked on the first semiconductor chip, and the first encapsulating layer and the second encapsulating layer surround the first semiconductor chip an...