ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,473,197, issued on Nov. 18, was assigned to XINTEC INC. (Taoyuan, Taiwan).
"Chip package" was invented by Wei-Luen Suen (Taoyuan, Taiwan), Jiun-Yen Lai (Taoyuan, Taiwan), Hsing-Lung Shen (Hsinchu, Taiwan) and Tsang-Yu Liu (Zhubei, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A chip package includes a semiconductor substrate and a metal layer. The semiconductor substrate has an opening and a sidewall surrounding the opening, in which an upper portion of the sidewall is a concave surface. The semiconductor substrate is made of a material including silicon. The metal layer is located on the semiconductor substrate. The metal layer has plural throu...