US Patent Issued to XINTEC on June 24 for "Chip package and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., June 25 -- United States Patent no. 12,341,109, issued on June 24, was assigned to XINTEC INC. (Taoyuan, Taiwan).

"Chip package and manufacturing method thereof" was invented by Chia-Ming Cheng (New Taipei, Taiwan) and Shu-Ming Chang (New Taipel, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A chip package includes a semiconductor substrate, a first light-transmissive sheet, a second light-transmissive sheet, a first antenna layer, and a redistribution layer. The first light-transmissive sheet is disposed over the semiconductor substrate, and has a top surface facing away from semiconductor substrate and an inclined sidewall adjacent to the top surface. The second light-transmissive ...