US Patent Issued to XINTEC on Dec. 16 for "Semiconductor device structure and semiconductor package assembly" (Taiwanese Inventors)

ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,500,141, issued on Dec. 16, was assigned to XINTEC INC. (Taoyuan, China).

"Semiconductor device structure and semiconductor package assembly" was invented by Po-Han Lee (Taipei, Taiwan) and Wei-Ming Chien (Taoyuan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device structure is provided. The semiconductor device structure includes a semiconductor substrate having a first surface and a second surface opposite thereto. A gallium nitride (GaN)-based device layer is formed on the first surface of the semiconductor substrate and has source, drain, and gate contact regions. First, second, and third through-substrate vias (TSVs) pass ...