ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,388,034, issued on Aug. 12, was assigned to XINTEC INC. (Taoyuan, Taiwan).
"Chip package and manufacturing method thereof" was invented by Chieh Chan (Taoyuan, Taiwan) and Yen-Chen Lee (Taipei, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A chip package includes a semiconductor structure and a redistribution layer. The semiconductor structure has a substrate, a first isolation layer, and a lower ground pad. The substrate has a top surface, a bottom surface opposite to the top surface, a through hole through the top surface and the bottom surface, and a sidewall surrounding the through hole. The first isolation layer is located on the top surfac...