US Patent Issued to XILINX on Sept. 30 for "Methods to extend NoC interconnect across multiple dice in 3D" (California, Colorado Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,430,275, issued on Sept. 30, was assigned to XILINX INC. (San Jose, Calif.).

"Methods to extend NoC interconnect across multiple dice in 3D" was invented by Aman Gupta (Sunnyvale, Calif.), Krishnan Srinivasan (San Jose, Calif.), Brian C. Gaide (Erie, Colo.), Ahmad R. Ansari (San Jose, Calif.) and Sagheer Ahmad (Cupertino, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments herein describe techniques to extend a network-on-chip (NoC) across multiple IC dice in 3D. An integrated circuit (IC) device includes first and second vertically-stacked IC dice, and an inter-die bus that interfaces between the second die and a NoC packet switch (NPS) ...