US Patent Issued to XILINX on Sept. 30 for "Chip package with integrated current control" (Taiwanese, American Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,431,416, issued on Sept. 30, was assigned to XILINX INC. (San Jose, Calif.).

"Chip package with integrated current control" was invented by Li-Sheng Weng (San Diego), Chun-Yuan Cheng (Zhubei, Taiwan) and Chao-Chin Lee (Zhunan Township, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A chip package and method for fabricating the same are provided that includes a power delivery network (PDN) with non-uniform electrical conductance. The electrical conductance through each current path of the PDN may be selected to balance the distribution of current flow across the current paths through the chip package, thus compensating for areas of high and low c...