ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,463,143, issued on Nov. 4, was assigned to XILINX INC. (San Jose, Calif.).
"Chip package with core embedded integrated devices" was invented by Li-Sheng Weng (San Diego) and Suresh Ramalingam (Fremont, Calif.).
According to the abstract* released by the U.S. Patent & Trademark Office: "A chip package and methods for fabricating the same are provided that include integrated devices embedded and coupled in series between a lower surface of a package substrate and an integrated circuit die of the chip package. In some examples, the integrated devices are disposed side by side embedded in a common package substrate. In other examples, one of the series coupled integrated devices is embedd...