ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,461,877, issued on Nov. 4, was assigned to XILINX INC. (San Jose, Calif.).
"3D stacked device having improved data flow" was invented by Dinesh D. Gaitonde (Fremont, Calif.), Aashish Tripathi (Hyderabad, India), Ashit Debnath (Hyderabad, India), Davis Boyd Moore (Longmont, Colo.), Maithilee Rajendra Kulkarni (Santa Clara, Calif.) and Abhishek Kumar Jain (Ghaziabad, India).
According to the abstract* released by the U.S. Patent & Trademark Office: "A 3D device includes a first semiconductor chip and a second semiconductor chip stacked vertically. The first semiconductor chip includes a first plurality of tiles. The second semiconductor chip includes a second plurality of tiles. A bus e...