US Patent Issued to XILINX on Nov. 25 for "Connectivity layer in 3D devices" (California Inventor)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,482,756, issued on Nov. 25, was assigned to XILINX INC. (San Jose, Calif.).

"Connectivity layer in 3D devices" was invented by Zachary Blair (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments herein describe a 3D stack of dies (e.g., an active-on-active (AoA) stack) with a connectivity die that enables the decoupling of processing regions in coupled dies from each other and from the physical location of I/O blocks on an I/O die. For example, the first die may have a plurality of hardware processing blocks that are arranged in a regular manner (e.g., an array with rows and columns). The connectivity die can include interconnects...