ALEXANDRIA, Va., June 17 -- United States Patent no. 12,315,781, issued on May 27, was assigned to XILINX INC. (San Jose, Calif.).
"Heat spreader for a semiconductor package" was invented by Gamal Refai-Ahmed (Santa Clara, Calif.) and Suresh Ramalingam (Fremont, Calif.).
According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed herein is a heat spreader for use with an IC package, the heat spreader having features for enhanced temperature control of the IC package. A heat spreader for use with an IC package is disclosed. In one example, the heat spreader includes a metal body that has a sealed internal cavity. A thermally conductive material fills the sealed internal cavity. The thermally conductive material ha...