US Patent Issued to XILINX on July 8 for "Coupled loop and void structure integrated in a redistribution layer of a chip package" (Taiwanese, American Inventors)

ALEXANDRIA, Va., July 9 -- United States Patent no. 12,354,978, issued on July 8, was assigned to XILINX INC. (San Jose, Calif.).

"Coupled loop and void structure integrated in a redistribution layer of a chip package" was invented by Po-Wei Chiu (Hsinchu, Taiwan), Tzu-No Chen (Kaohsiung, Taiwan), Hong Shi (Los Gatos, Calif.), Li-Sheng Weng (San Diego) and Young Soo Lee (Santa Clara, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed herein is a chip package and method for fabricating the same are provided that includes a redistribution layer (RDL) with a plurality of loop and void structures. The chip package includes an integrated circuit (IC) die, and a package substrate. The RDL is disposed ...