ALEXANDRIA, Va., July 16 -- United States Patent no. 12,361,808, issued on July 15, was assigned to XILINX INC. (San Jose, Calif.).
"Tamper sensor for 3-dimensional die stack" was invented by Thomas Paul Leboeuf (Sandia Park, N.M.), James Anderson (Madison, Ala.), James D. Wesselkamper (Albuquerque, N.M.) and Jason J. Moore (Albuquerque, N.M.).
According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated circuit die stack and method thereof are described herein that is capable of detecting a physical tampering event. The integrated circuit die stack includes a first integrated circuit die including a sensor network that extends substantially across an entire top surface of the first integrated circuit die, and...