US Patent Issued to XILINX on April 8 for "Redundancy scheme for activating circuitry on a base die of a 3D stacked device" (Colorado Inventor)

ALEXANDRIA, Va., April 9 -- United States Patent no. 12,271,332, issued on April 8, was assigned to XILINX INC. (San Jose, Calif.).

"Redundancy scheme for activating circuitry on a base die of a 3D stacked device" was invented by Brian C. Gaide (Erie, Colo.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A 3D stacked device includes a plurality of semiconductor chips stacked in a vertical direction. The semiconductor chips each include a plurality of portions grouped into slivers according to the column they lie in. Each of the portions further includes a plurality of blocks grouped into sub-slivers and interconnected by inter-block bridges. A block that must be functional on the bottommost chip of the 3D sta...