US Patent Issued to XIAMEN SANAN OPTOELECTRONICS on Oct. 7 for "Flip-chip light emitting diode having connecting electrodes with multiple binding layers including eutectic system with tin" (Chinese Inventors)

ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,439,753, issued on Oct. 7, was assigned to XIAMEN SANAN OPTOELECTRONICS Co. LTD. (Xiamen, China).

"Flip-chip light emitting diode having connecting electrodes with multiple binding layers including eutectic system with tin" was invented by Shiwei Liu (Xiamen, China), Gaolin Zheng (Xiamen, China), Anhe He (Xiamen, China), Qing Wang (Xiamen, China), Su-Hui Lin (Xiamen, China), Kang-wei Peng (Xiamen, China), Ling-yuan Hong (Xiamen, China) and Jiangbin Zeng (Xiamen, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A light-emitting device includes a carrier substrate, a flip-chip light-emitting diode (LED) mounted onto the carrier substrate, and an electr...