US Patent Issued to XI'AN YEP TELECOM TECHNOLOGY on Dec. 9 for "Liquid-cooling heat dissipation device, cabinet, and system" (Chinese Inventor)

ALEXANDRIA, Va., Dec. 9 -- United States Patent no. 12,495,527, issued on Dec. 9, was assigned to XI'AN YEP TELECOM TECHNOLOGY Co. LTD. (Shaanxi, China).

"Liquid-cooling heat dissipation device, cabinet, and system" was invented by Zhongjiang Qu (Shaanxi, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A liquid-cooling heat dissipation device includes a pipeline outlet formed on an exterior sidewall of a chassis, wherein the exterior sidewall is an exterior wall of side panel in contact with a chassis panel and an IO port panel of the chassis, a circuit board fixed on an inner bottom surface of the chassis, an evaporator fixed on the circuit board with a preset gap, forming an accommodating space with t...