US Patent Issued to XI'AN ESWIN MATERIAL TECHNOLOGY, XI'AN ESWIN SILICON WAFER TECHNOLOGY on Jan. 28 for "Silicon material processing apparatus, silicon ingot production equipment, and silicon material processing method" (Chinese Inventors)

ALEXANDRIA, Va., Jan. 29 -- United States Patent no. 12,209,326, issued on Jan. 28, was assigned to XI'AN ESWIN MATERIAL TECHNOLOGY Co. LTD. (Xi'an, China) and XI'AN ESWIN SILICON WAFER TECHNOLOGY Co. LTD. (Xi'an, China).

"Silicon material processing apparatus, silicon ingot production equipment, and silicon material processing method" was invented by Fan Chen (Xi'an, China), Pengju Zhang (Xi'an, China) and Chaochao Guo (Xi'an, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A silicon material processing apparatus includes a feed assembly, a scanning assembly, a controller, and a loading assembly. The feed assembly is used for conveying a silicon material and includes a feeding area, a scanning area, an...