US Patent Issued to WUXI ESIONTECH on April 29 for "High-speed low-latency interconnect interface (HLII) for silicon interposer interconnection" (Chinese Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,287,748, issued on April 29, was assigned to WUXI ESIONTECH Co. LTD. (Wuxi, China).

"High-speed low-latency interconnect interface (HLII) for silicon interposer interconnection" was invented by Xiaojie Ma (Wuxi, China), Yanfeng Xu (Wuxi, China), Yuting Xu (Wuxi, China), Boyin Chen (Wuxi, China), Yanfei Zhang (Wuxi, China) and Yueer Shan (Wuxi, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A high-speed low-latency interconnect interface (HLII) for silicon interposer interconnection is provided. The HLII is configured to perform large-scale input/output (I/O) interconnection on a silicon interposer, and includes a physical link (PL) and an LL (LL). ...