US Patent Issued to Wuhan Xinxin Semiconductor Manufacturing on Nov. 4 for "Bonding structure and manufacturing method therefor" (Chinese Inventors)

ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,463,165, issued on Nov. 4, was assigned to Wuhan Xinxin Semiconductor Manufacturing Co. Ltd. (Hubei, China).

"Bonding structure and manufacturing method therefor" was invented by Xing Hu (Wuhan, China), Tianjian Liu (Wuhan, China) and Sheng Hu (Wuhan, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A bonding structure and a manufacturing method therefor. A first hybrid bonding structure is formed on a first wafer; an interconnection structure and a second hybrid bonding structure are formed on the front surface of a second wafer. The first wafer and the second wafer are bonded by means of the first hybrid bonding structure and the second hybrid bond...