US Patent Issued to WUHAN XINXIN SEMICONDUCTOR MANUFACTURING on June 3 for "Large die wafer, large die and method of forming the same" (Chinese Inventors)

ALEXANDRIA, Va., June 4 -- United States Patent no. 12,322,707, issued on June 3, was assigned to WUHAN XINXIN SEMICONDUCTOR MANUFACTURING Co. LTD. (Hubei, China).

"Large die wafer, large die and method of forming the same" was invented by Sheng Hu (Hubei, China), Jun Zhou (Hubei, China), Peng Sun (Hubei, China), Qiong Zhan (Hubei, China), Senhua Shi (Hubei, China) and Hu Yang (Hubei, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention provides a large die, a method of forming the large die and a large die wafer. The method includes: providing a wafer containing a plurality of large dies each having a size greater than that of a maximum field of exposure of a stepper, each large die in...