US Patent Issued to WUHAN XINXIN SEMICONDUCTOR MANUFACTURING on July 22 for "Wafer assembly having alignment marks, method for forming same, and wafer alignment method" (Chinese Inventors)

ALEXANDRIA, Va., July 23 -- United States Patent no. 12,368,110, issued on July 22, was assigned to WUHAN XINXIN SEMICONDUCTOR MANUFACTURING Co. LTD. (Wuhan, China).

"Wafer assembly having alignment marks, method for forming same, and wafer alignment method" was invented by Guoliang Ye (Hubei, China), Xing Hu (Hubei, China) and Hongsheng Yi (Hubei, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wafer assembly with alignment marks, a method for forming the wafer assembly and a wafer alignment method are disclosed. The alignment marks are disposed in bonding layers and dielectric layers on first and second wafers. Light reflected by a first dot mark and a first block mark on the first wafer, which are ...