US Patent Issued to WUHAN XINXIN SEMICONDUCTOR MANUFACTURING on July 1 for "Memory packaged chip and signal processing method therefor" (Chinese Inventor)

ALEXANDRIA, Va., July 3 -- United States Patent no. 12,347,493, issued on July 1, was assigned to WUHAN XINXIN SEMICONDUCTOR MANUFACTURING Co. LTD. (Wuhan, China).

"Memory packaged chip and signal processing method therefor" was invented by Zhiyong Han (Wuhan, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A memory packaged chip and a signal processing method therefor are provided. The memory packaged chip includes at least a memory chip and an expander chip capable of receiving a same external input signal; there are a pair of inter-chip pins connected to each other between the memory chip and the expander chip; and the memory chip generates a first control signal according to the external input signa...