ALEXANDRIA, Va., March 19 -- United States Patent no. 12,255,175, issued on March 18, was assigned to Wuhan Sanxuan Technology Co. Ltd (Wuhan, China).
"Wafer warpage regulation epoxy functional film, and preparation method and application thereof" was invented by De Wu (Wuhan, China), Qiao Zhou (Wuhan, China), Shuhang Liao (Wuhan, China) and Junxing Su (Wuhan, China).
According to the abstract* released by the U.S. Patent & Trademark Office: "Provided in the present invention is a wafer warpage regulation epoxy functional film. The wafer warpage regulation epoxy functional film includes the raw material components, in percentage by mass, 33% of an epoxy resin, 50%-52% of silica, 12%-14% of a curing agent, 1% of a curing accelerator, and 2...