US Patent Issued to WUHAN NEURACOM TECHNOLOGY DEVELOPMENT on Oct. 7 for "Reverse soldering connection structure of microneedle and wiring and preparation process therefor" (Chinese Inventors)

ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,434,315, issued on Oct. 7, was assigned to WUHAN NEURACOM TECHNOLOGY DEVELOPMENT Co. LTD. (Wuhan, China).

"Reverse soldering connection structure of microneedle and wiring and preparation process therefor" was invented by Li Huang (Wuhan, China), Cheng Huang (Wuhan, China), Guangyan Cai (Wuhan, China), Jianfei Gao (Wuhan, China), Chunshui Wang (Wuhan, China) and Chao Wang (Wuhan, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed are a reverse soldering connection structure of a microneedle and a wiring and a preparation process thereof. The reverse soldering metal layer of the microneedle is prepared; the reverse soldering metal layer of the...