ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,438,001, issued on Oct. 7, was assigned to WOLFSPEED INC. (Durham, N.C.).

"Off axis laser-based surface processing operations for semiconductor wafers" was invented by Simon Bubel (Carrboro, N.C.) and Josephus Daniel Ferguson (Apex, N.C.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Systems and methods for laser-based surface processing operations on a semiconductor wafer, such as a silicon carbide semiconductor wafer, are provided. In one example, a method includes providing a semiconductor workpiece having a surface. The method includes providing emission of one or more lasers to the surface of a semiconductor workpiece at a non-perpendicular incidenc...