ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,434,330, issued on Oct. 7, was assigned to WOLFSPEED INC. (Durham, N.C.).

"Laser-based surface processing for semiconductor workpiece" was invented by Devon Michael Diehl (Durham, N.C.) and Joshua Venton Negley (Hillsborough, N.C.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Systems and methods for laser-based surface processing operations on a wide bandgap semiconductor wafer, such as a silicon carbide semiconductor wafer, are provided. In one example, a method includes removing a wide bandgap semiconductor wafer from a boule using a removal process. The method includes ablating, with one or more lasers, an exposed surface resulting from the removal p...