US Patent Issued to Wolfspeed on Nov. 11 for "Semiconductor device packages with exposed heat dissipating surfaces and methods of fabricating the same" (Malaysian, American Inventors)

ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,470,185, issued on Nov. 11, was assigned to Wolfspeed Inc. (Durham, N.C.).

"Semiconductor device packages with exposed heat dissipating surfaces and methods of fabricating the same" was invented by Alexander Komposch (Morgan Hill, Calif.), Eng Wah Woo (Ipoh, Malaysia), Soon Lee Liew (Ipoh, Malaysia) and Kok Meng Kam (Ipoh, Malaysia).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device package includes an interconnect structure with a first surface having at least one die thereon and a second surface that is opposite the first surface and is configured to be coupled to an external device. A protective structure on the first surface of the...