US Patent Issued to Wolfspeed on May 27 for "Limiting failures caused by dendrite growth on semiconductor chips" (American, Malaysian Inventors)

ALEXANDRIA, Va., June 17 -- United States Patent no. 12,315,836, issued on May 27, was assigned to Wolfspeed Inc. (Durham, N.C.).

"Limiting failures caused by dendrite growth on semiconductor chips" was invented by Dan Namishia (Wake Forest, N.C.), Mitch Flowers (Durham, N.C.), Eng Wah Woo (Ipoh, Malaysia) and Erwin Cohen (Durham, N.C.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor chip comprises a substrate, a die attach material, and a die. The substrate comprises an upper surface and a lower surface opposing the upper surface. The die attach material is on the upper surface of the substrate. The die comprises a bottom surface bonded to the upper surface of the substrate by the die attach m...