ALEXANDRIA, Va., June 17 -- United States Patent no. 12,315,729, issued on May 27, was assigned to WOLFSPEED INC. (Durham, N.C.).
"Laser-based processing for semiconductor wafers" was invented by Devon Michael Diehl (Durham, N.C.).
According to the abstract* released by the U.S. Patent & Trademark Office: "An example method includes providing a first semiconductor workpiece including a first portion and a second portion. The example method includes providing emission of one or more lasers through a thickness of the first semiconductor workpiece to remove the first portion of the first semiconductor workpiece from the second portion. In some implementations, the second portion has a shape corresponding to a second semiconductor workpiece o...