ALEXANDRIA, Va., July 16 -- United States Patent no. 12,362,237, issued on July 15, was assigned to WOLFSPEED INC. (Durham, N.C.).
"Fill-in planarization system and method" was invented by Simon Bubel (Carrboro, N.C.) and Alexander Kevin Shveyd (Chapel Hill, N.C.).
According to the abstract* released by the U.S. Patent & Trademark Office: "Systems and methods for laser-based surface processing operations on a wide bandgap semiconductor wafer, such as a silicon carbide semiconductor wafer, are provided. In one example, a method includes providing a semiconductor workpiece having a surface, the semiconductor workpiece including silicon carbide. The method includes providing a filler material on at least a portion of the surface. The method ...