ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,521,840, issued on Jan. 13, was assigned to WOLFSPEED INC. (Durham, N.C.).

"Two component chemical mechanical polishing" was invented by Simon Bubel (Carrboro, N.C.) and Dinusha Priyadarshani Karunaratne (Cary, N.C.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Systems and methods for polishing semiconductor workpieces are provided. In one example, the polishing system includes a platen operable to rotate about an axis. The polishing system further includes a polishing pad on the platen. The polishing system further includes a workpiece carrier operable to bring a semiconductor workpiece into contact with the polishing pad. The polishing pad includes a...