US Patent Issued to Wolfspeed on Feb. 10 for "Packaged electronic devices having transient liquid phase solder joints and methods of forming same" (Arkansas Inventor)

ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,550,406, issued on Feb. 10, was assigned to Wolfspeed Inc. (Durham, N.C.).

"Packaged electronic devices having transient liquid phase solder joints and methods of forming same" was invented by Sayan Seal (Fayetteville, Ark.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A packaged electronic device comprises a power semiconductor die that includes a first terminal and a second terminal, a power substrate comprising a dielectric substrate having a first metal cladding layer on an upper surface thereof, an encapsulation covering the power semiconductor die and at least a portion of the power substrate, a first lead extending through the encapsulation that...