US Patent Issued to Wolfspeed on Aug. 26 for "Silicon carbide thermal bridge integrated on a low thermal conductivity substrate and processes implementing the same" (California, North Carolina Inventors)

ALEXANDRIA, Va., Aug. 26 -- United States Patent no. 12,402,240, issued on Aug. 26, was assigned to Wolfspeed Inc. (Durham, N.C.).

"Silicon carbide thermal bridge integrated on a low thermal conductivity substrate and processes implementing the same" was invented by Haedong Jang (San Jose, Calif.), Marvin Marbell (Cary, N.C.) and Jeremy Fisher (Raleigh, N.C.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A component includes a substrate board; a thermal bridge structured and arranged on the substrate board, where the thermal bridge is configured to transfer heat from the substrate board including an area adjacent to or on a hotspot of the substrate board; where the thermal bridge is configured to transfer th...