ALEXANDRIA, Va., April 9 -- United States Patent no. 12,272,660, issued on April 8, was assigned to Wolfspeed Inc. (Durham, N.C.).
"Transistor packages with improved die attach" was invented by Arthur Pun (Raleigh, N.C.).
According to the abstract* released by the U.S. Patent & Trademark Office: "A transistor device structure may include a submount, a transistor device on the carrier submount, and a metal bonding layer between the submount and the transistor die, the metal bonding stack providing mechanical attachment of the transistor die to the submount. The metal bonding stack may include gold, tin and nickel. A weight percentage of a combination of nickel and tin in the metal bonding layer is greater than 50 percent and a weight perce...