US Patent Issued to Wolfspeed on April 22 for "Power semiconductor devices with improved overcoat adhesion and/or protection" (North Carolina Inventors)

ALEXANDRIA, Va., June 6 -- United States Patent no. 12,283,534, issued on April 22, was assigned to Wolfspeed Inc. (Durham, N.C.).

"Power semiconductor devices with improved overcoat adhesion and/or protection" was invented by In Hwan Ji (Durham, N.C.), Jae-Hyung Park (Apex, N.C.) and Philipp Steinmann (Durham, N.C.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A power semiconductor device includes a semiconductor layer structure and a protective overcoating on a bonding surface of the semiconductor layer structure. The bonding surface includes a plurality of adhesion features along an interface with the protective overcoating. The adhesion features protrude from and/or are recessed in the bonding surface, ...