ALEXANDRIA, Va., Aug. 20 -- United States Patent no. 12,390,879, issued on Aug. 19, was assigned to WITS Co. LTD. (Gyeonggi-Do, South Korea).
"Dual type ultrasonic bonding apparatus and bonding method using the same" was invented by Du Hyun Song (Suwon-si, South Korea) and Chun Su Yoon (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed is a dual heating type ultrasonic bonding apparatus including a stage, a part seating jig disposed on the stage, and an ultrasonic bonding unit disposed to correspond to the part seating jig and that bonds dissimilar parts seated on the part seating jig. The stage includes a first heater that transfers heat to the dissimilar parts through the part ...