US Patent Issued to WISOL on Oct. 21 for "Surface acoustic wave wafer level packages with organic solderability preservative coating layers and manufacturing methods thereof" (South Korean Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,451,862, issued on Oct. 21, was assigned to WISOL Co. LTD. (Gyeonggi-Do, South Korea).

"Surface acoustic wave wafer level packages with organic solderability preservative coating layers and manufacturing methods thereof" was invented by Suk Hwan Jang (Gyeonggi-do, South Korea), Byung Hak Kim (Gyeonggi-do, South Korea) and Chang Yup Lee (Gyeonggi-do, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A surface acoustic wave wafer level package includes a substrate, an interdigital transducer (IDT) formed on the substrate, a sidewall formed on the substrate along a periphery of the IDT, a cover formed above the sidewall and the IDT to form a hollo...