US Patent Issued to WISOL on March 11 for "Film bulk acoustic resonator chip and package structure with improved power tolerance" (South Korean Inventor)

ALEXANDRIA, Va., March 12 -- United States Patent no. 12,249,975, issued on March 11, was assigned to WISOL Co. LTD. (Osan-si, South Korea).

"Film bulk acoustic resonator chip and package structure with improved power tolerance" was invented by Young Hun Kim (Osan-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A film bulk acoustic resonator (FBAR) chip and package structure with improved power tolerance includes: a first substrate having a plurality of FBARs each having a bottom electrode, a piezoelectric material, and a top electrode, and first bonding pads connected to the bottom electrodes or the top electrodes of the FBARs; and a second substrate having a plurality of vias passing thereth...