ALEXANDRIA, Va., June 5 -- United States Patent no. D1,071,114, issued on April 15, was assigned to WishTech Co. Ltd..
"Heat dissipation mesh" was invented by Yu-Sung Li (Chiayi County, Taiwan).
The patent was filed on March 24, 2023, under Application No. D/887,738.
*For further information, including images, charts and tables, please visit: http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&p=1&u=%2Fnetahtml%2FPTO%2Fsearch-bool.html&r=1&f=G&l=50&co1=AND&d=PTXT&s1=D1071114&OS=D1071114&RS=D1071114
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