US Patent Issued to WINGO TECHNOLOGY on April 8 for "Polyimide compound and molded article comprising the polyimide compound" (Japanese Inventors)

ALEXANDRIA, Va., April 9 -- United States Patent no. 12,269,949, issued on April 8, was assigned to WINGO TECHNOLOGY Co. LTD. (Okayama, Japan).

"Polyimide compound and molded article comprising the polyimide compound" was invented by Toshiyuki Goshima (Okayama, Japan) and Win Maw Soe (Okayama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided a polyimide compound having high heat resistance and transparency. The polyimide compound according to the present invention is characterized in that it is a reaction product of a diamine compound represented by the following general formula (1): and an alicyclic tetracarboxylic acid dianhydride represented by the following general formula (2)."

The patent ...