US Patent Issued to WINDBOND ELECTRONICS on Oct. 28 for "Pick-up structure for memory device and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,456,639, issued on Oct. 28, was assigned to WINDBOND ELECTRONICS CORP. (Taichung, Taiwan).

"Pick-up structure for memory device and manufacturing method thereof" was invented by Tsung-Wei Lin (Taichung, Taiwan), Chun-Yen Liao (Taichung, Taiwan), Kun-Che Wu (Taichung, Taiwan), Cheng-Ta Yang (Taichung, Taiwan) and Chun-Sheng Wu (Taichung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A pick-up structure for a memory device and method for manufacturing memory device are provided. The pick-up structure includes a substrate and a plurality of pick-up electrode strips. The substrate has a memory cell region and a peripheral pick-up region adjacent the...