US Patent Issued to Windbond Electronics on Nov. 11 for "Memory device and wrap around read method thereof" (Taiwanese Inventor)

ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,469,528, issued on Nov. 11, was assigned to Windbond Electronics Corp. (Taichung, Taiwan).

"Memory device and wrap around read method thereof" was invented by Chung-Zen Chen (Taichung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A memory device including a memory cell array, a signal generator, a word line decoder, a bit line decoder, a sensing amplifier circuit and a register circuit is provided. The signal generator generates a control signal according to a wrap around read command. The word line decoder, the bit line decoder, and the sensing amplifier circuit read data stored in the memory cell array according to the wrap around read comman...