US Patent Issued to Windbond Electronics on May 20 for "Manufacturing method of semiconductor device" (Taiwanese Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,310,000, issued on May 20, was assigned to Windbond Electronics Corp. (Taichung, Taiwan).

"Manufacturing method of semiconductor device" was invented by Te-Hsuan Peng (Taichung, Taiwan) and Kai Jen (Taichung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device including a substrate, a capacitor, a stop layer, a first contact, and a second contact is provided. The substrate includes a memory array region and a peripheral circuit region. The capacitor is located in the memory array region. The capacitor includes a first electrode, a second electrode, and an insulating layer. The second electrode is located on the first electrode. ...